Semiconductor Test & Measurement Solutions: Precision for Semiconductor Excellence

Overview

Industrial Physics delivers test and measurement solutions built for the demands of advanced semiconductor manufacturing. In this video, you’ll see how trace oxygen analysis at the 2 ppm level, non-contact coating thickness measurement, and precision testing across SMT ovens, TCB equipment, vacuum chambers, and advanced packaging processes enable the accuracy that makes mass production of next-generation chips possible.

Key Testing Capabilities for Semiconductors

• Trace oxygen analysis at the 2 ppm level (EC913 and ZR810 series)
• Gas analysis for inert atmospheres and vacuum chamber purity
• Non-contact coating thickness measurement (0.2 to 250 microns)
• Optical testing for coating transparency and film clarity
• Contact angle testing for surface wettability and cleanliness
• Salt spray corrosion testing for electronic components
• Air and vacuum leak testing to IP67 sealing requirements
• Temperature and climatic tracking for reflow and curing
• Technology from SpecMetrix, TQC Sheen, Systech, C&W, and TME

What You’ll Learn in This Video

• 00:00 – Introduction to semiconductor manufacturing quality control
• 00:08 – Why oxygen contamination and process precision matter
• 00:22 – Overview of the testing solutions portfolio
• 01:15 – Advanced packaging expertise and global service support

Critical Testing for Semiconductor Manufacturing

In semiconductor manufacturing, oxygen contamination means oxidation, failed bonds, and compromised yields that cost millions. When you’re producing next-generation chips at the cutting edge of technology, precision is the difference between successful mass production and costly failures.

Industrial Physics provides trace oxygen analysis at the 2 ppm level, non-contact coating thickness measurement, and precision testing across the processes that define advanced chip production. From SMT ovens and TCB equipment to vacuum chambers and advanced packaging, this enables chip manufacturers, equipment OEMs, and electronics assembly operations to maintain the accuracy required for mass production of next-generation chips.

Typical Applications

• Advanced chip and logic manufacturing
• SMT and TCB equipment processes
• Advanced packaging and thin film deposition
• Electronics assembly and component sealing
• Equipment OEMs and R&D laboratories

Technical Summary

• Test parameters: Trace oxygen (2 ppm level), gas analysis, coating thickness (0.2-250 microns), optical, contact angle, corrosion (salt spray), air/vacuum leak (IP67), temperature/climatic
• Named products: EC913 and ZR810 oxygen analysers, SpecMetrix thickness systems, Fibro PGX+ contact angle tester, C&W salt spray chambers, TME Worker leak systems, TQC Sheen oven trackers
• Standards: IP67 sealing referenced; no other specific standards stated – confirm before adding
• Brands: SpecMetrix, TQC Sheen, Systech, C&W, TME

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Speak With an Expert

If you’re looking to maintain the precision required for advanced semiconductor production, our team is here to support you. Contact our experts today.