TAPPI T569

Introducing TAPPI T569 – Industrial Physics

TAPPI T569 is an industry standard method for measuring the energy needed to quickly delaminate a sheet-type specimen. This internal bond test method is regularly used in testing solutions for a wide range of packaging materials and can return essential QA information on how well a sheet will perform under stress.

The TAPPI T569 method
Suitable for single and multi-ply paper and paperboard as well as coated sheets or sheets laminated with synthetic polymer films, Tappi T 569 compliant testing methods can test the internal bonds of a wide range of materials. From cardboard and corrugated paper to adhesives, films and foils there is a testing solution to determine its internal bond strength.

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Understanding the TAPPI T569 technique
To test to the TAPPI T569 standard, the specimen needs to be sandwiched between two double-coated tape substrates. A falling pendulum or weight is then dropped to create a high-speed impact. The total energy required to delaminate the internal fibers of a specimen in a Z type direction into two plies is measured to determine the specimen’s internal bond strength.

The weight of the pendulum required will vary depending on the kind of specimens being tested. Some testing machines are able to test more than one specimen at a time and many offer a function to press and cut specimens automatically, saving on prep time.

The other standard testing method for determining the internal bond strength of a sheet is ISO 16260. Find out more about the ISO 16260 method.

What materials aren’t suitable for TAPPI T569 testing?
To test the internal bond of a sheet using the TAPPI T569 method, the specimen needs to be subjected to a relatively high pressure environment and sandwiched between two double-coated tape substrates. This means it may not be suitable for testing low basis weight (below 40 g/m2), porous, soft or low-density materials, like tissue, or high-strength hand sheets.

Need TAPPI T569 testing solutions? Get in touch

If you have any questions at a about TAPPI T569 or how bond testing might fit into your QA process, we will be happy to help. With almost 100 years’ experience in test and inspect solutions, we have the knowledge to help. For more information, get in touch.

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