Join us at the Pack Expo (Packaging and Processing) Tradeshow

Aug 9, 2022

CMC-KUHNKE

Flexible packaging

Messmer Buchel

Ray Ran

Systech

Technidyne

Testing Machines Inc

TME

Join us at the Pack Expo (Packaging and Processing) Tradeshow

Join us at the Pack Expo event in Chicago, IL from October 23-26, 2022. Industrial Physics and its family of brands (Testing Machines Inc., TM Electronics, Messmer Buchel, CMC KUHNKE, United Testing Systems, Oxysense, and Technidyne ) will be present to demonstrate our world class packaging and processing instruments from corrugated, to paper, to plastics, and so much more to provide you with test and measurement solutions for your packaging needs. Visit us at Booth #W-24030.

Our packaging testing technologies on display will include micrometers, tear testers, oxygen analyzers, seam inspectors, and falling dart impact testers.

Not yet registered to attend? Click here to join us and hundreds of other industry enthusiasts.

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